Type: | Wire |
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Material: | Tin |
Flux Containing: | Containing Flux |
Slag Characteristic: | Non |
Extended Length: | <10mm |
Transport Package: | Plastic Spool, Drum, Plywood Pallet |
Customization: |
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Solder is an indispensable material for the manufacture of electronic products. Tin wire, tin bar, and tin paste are the most widely used electronic welding materials, the technical level depends on the performance of solder joints and welding process performance.
Standard Rosin Flux Core
No external flux needed
Fast melting
Quick fluidity
Solid wire without flux available (optional)
Ingredient (WT%) | Melting point(ºC) | Density (g/cm3) |
Sn63Pb37 | 183 | 8.4 |
Sn60Pb40 | 183-190 | 8.5 |
Sn55Pb45 | 183-203 | 8.7 |
Sn50Pb50 | 183-215 | 8.9 |
Sn45Pb55 | 183-227 | 9.1 |
Sn40Pb60 | 183-238 | 9.3 |
Sn35Pb65 | 183-248 | 9.5 |
Sn30Pb70 | 183-258 | 9.7 |
Sn20Pb80 | 183-279 | 10.1 |
Hard paper drum | 100-150 kg | outer diameter 550 mm, inner diameter300mm, variable height |
Hard paper drum | 20-50 kg | outer diameter 400 mm, inner diameter190mm. variable height |
Plastic spool | 15 kg | flange300mm, width100mm, center hole:55mm |
Plastic spool | 0.5-10 kg | |
bundle | 10-20 kg |
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