Solder is an indispensable material for the manufacture of electronic products. Tin wire, tin bar, and tin paste are the most widely used electronic welding materials, the technical level depends on the performance of solder joints and welding process performance.
Tin base Babbitts are considered superior to Lead base alloys for most applications because they are easier to pour and provide a good bond between the bearing shell and lining. In this process, Babbitt ingots are melted and then poured into bearing cavities, allowed to harden, and then the surface is machined down to meet required tolerances.
Product code: solder wire
Chemical composition:
| ITEM |
Melting Range (ºC) |
Elements (%) |
| Sn |
Ag |
Cu |
Sb |
Pb |
Cd |
Fe |
As |
Al |
Zn |
Bi |
TTL Impurities |
| S-SnCu0.7 |
227 |
REMAINING |
0.1 |
0.5-0.9 |
0.1 |
0.05 |
0.0012 |
0.02 |
0.03 |
0.001 |
0.001 |
0.015 |
0.2 |
| S-SnCu0.3 |
227~235 |
REMAINING |
0.1 |
0.2-0.4 |
| S-SnCu3 |
227~310 |
REMAINING |
0.1 |
2.5-3.5 |
| S-SnAg1Cu0.5 |
217~227 |
REMAINING |
0.8-1.2 |
0.3-0.7 |
| S-SnAg3Cu0.5 |
217~220 |
REMAINING |
2.8-3.2 |
0.3-0.7 |
| S-SnAg4Cu0.5 |
217~219 |
REMAINING |
3.8-4.2 |
0.3-0.7 |
| S-SnCu0.7Ag0.3 |
217~227 |
REMAINING |
0.2-0.4 |
0.5-0.9 |
| S-SnCu4Ag1 |
217~353 |
REMAINING |
0.8-1.2 |
3.5-4.5 |
| S-SnCu6Ag2 |
217~380 |
REMAINING |
1.8-2.2 |
5.5-6.5 |
| S-SnSb5 |
235~240 |
REMAINING |
0.1 |
0.05 |
Size: 295*20*13mm
Product packing:
20kg per carton.
There is a variety of Lead-free solder wire that has a smooth surface, neat coiling, beautiful appearance, uniform distribution of additives, good continuity. Less splash of additives in the welding process, good mobility, good we1ability, less smoke, less oxide slag, bright welding spots.for use as coating feedstock material for the electric arc wire spray processes.
Widely used in a variety of wave soldering and manual welding of television, audio, capacitors, circuit boards, and communications equipment. and look forward to your cooperation!
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